The Defense Advanced Research Projects Agency (DARPA) will host the first annual Next-Generation Microelectronics Manufacturing Summit (NGMM) to convene stakeholders from across defense, academia, and industry to learn more about the program and how they can utilize the capability in the future to support their research, prototyping programs, and product fabrication. Highlights include:• Inside NGMM: Early customer/partner engagement, program timeline, and ways to get involved in three-dimensional multi-material, heterogeneously integrated (3DHI) research and development (R&D) and prototyping.• Technology roadmap: Overview of 3DHI technology roadmap and design/development infrastructure.• Progress in action: Hear the latest on facility, infrastructure, equipment, and key milestones in process development.This in-person meeting will be held on October 27–28, 2025, at The University of Texas at Austin’s AT&T Hotel and Conference Center from 8:30 a.m. to 5:00 p.m. CT on October 27, and from 8:30 a.m. to 1:30 p.m. CT on October 28, 2025.The NGMM Summit will include overview presentations by government, industry, and academic personnel. There will be time allotted for discussions and networking amongst the participants. All presentations and discussions will be held at the UNCLASSIFIED level. All attendees are required to present government-issued photo identification upon entry to the event.